Standard Specifications of JEL SAL38C3HV
| Carrying Object | SEMI standard 200 to 300 mm wafer (Transparent, translucent, silicon) |
|---|---|
| Positioning Time | Centering : 3 sec (Wafer pick-up/placing time excluded) |
| Positioning Accuracy | Centering: Within ±0.1 mm Flat locating/Notch locating: Within ±0.1 deg |
| Sensor | LED light + wafer edge detection with image sensor unit |
| Wafer Size Change | By command control or switch |
| Cleanliness | ISO Class 2 (at wafer transfer level when exhausting driving part) |
| Driving Method | 2-phase stepping motor (for 3 axes) Internal motor driver, controller |
| Utility | Power: DC24V±10% 3A Vacuum: -53 kPa or more |
Reviews
There are no reviews yet.