Characteristics of JEL STCR4160S-F:
Designed for handling small wafers in a production line or inspection line of semiconductor.
Certified CE marking.
- Arm lineup: 100mm, 130mm, 160mm, 200mm
- Twin-arm reduces the wafer swap time.
- Base or flange mounting type is selectable.
- Motion monitoring is available.
- RS232C and parallel photo I/O are standard for control.
- 2-phase stepping motor installed in all axes.
- High-speed, high-accuracy wafer handlingby S-curved speed control.
- Wafer holding: end-effector with vacuum suction, passive edge, edge grip type End-effector.
- End-effector material: CFRP, Al, ceramic, or others.
- Optimal end-effector is selectable according to the carrying object and line layout.
Standard Specifications of JEL STCR4160S-F:
| Specifications of Robot | ||||
|---|---|---|---|---|
| Robot Model | STCR4160S-300-PM | |||
| Carrying Object | Wafer up to 300mm | |||
| Wafer Holding Method | By vacuum suction | |||
| Robot Model Type | Cylindrical coordinate type | Control Axis | 4-axis | |
| Motor Type | Stepping motor | |||
| Operating Range | From the robot center to the wafer center | Rotation Angle (Theta-axis) | Vertical Stroke (Z-axis) | |
| 575mm | 340deg | 300mm | ||
| Carrying Speed (Ave.) | Arm (R-axis) | Rotation Angle (Theta-axis) | Vertical Stroke (Z-axis) | |
| 570mm/sec | 220deg/sec | 200mm/sec | ||
| Carrying Speed (Max.) | Arm (R-axis) | Rotation Angle (Theta-axis) | Vertical Stroke (Z-axis) | |
| 1140mm/sec | 270deg/sec | 250mm/sec | ||
| Resolution | Arm (R-axis) | Rotation Angle (Theta-axis) | Vertical Stroke (Z-axis) | |
| Below 12.6µm | 0.0045deg | 6.25µm | ||
| Handling level | 620mm (Base mounting level to upper end-effector level) | |||
| Repeatability | Within ±0.1mm | |||
| Cleanliness | ISO Class 2 (at wafer transfer level when exhausting driving part) | |||
| Utility | Power: DC24V±10% 16A; Vacuum: -53kPa or more | |||
| Mass | Approx. 30kg | |||
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