Features of the MALCOM FS-1 Wave soldering furnace simulation device:
- Small Solder Reservoir: Allows for easy transition between different solder materials.
- Flux Compatibility: Easily switch flux materials.
- Visual Observation: The solder joint formation can be observed directly.
- Nitrogen Environment: Enables soldering experiments under nitrogen gas conditions.
Specifications of the MALCOM FS-1 Wave soldering furnace simulation device:
| Category | Specifications |
|---|---|
| Standard PCB Size | 70mm×70mm (Soldering surface: 50mm×50mm) |
| Device Dimensions | W1100×D610×H700mm |
| Conveyor Width | Fixed at 70mm |
| Conveyor Speed | 0.6～1.8m/min |
| Conveyor Angle | 0～7° |
| Effective Top PCB Surface Area | 30mm |
| Effective Bottom PCB Surface Area | 5mm |
| Heating Method | 700W Laser |
| Temperature Control | PID Controller |
| Flux Amount | Spray machine (1L capacity) |
| Solder Reservoir | Dual-wave method (13kg capacity) |
| Solder Heating Capacity | 640W |
| Reservoir Heating Method | PID Controller |
| Exhaust Duct Size | 70mm diameter |
| Tin Exposure Time | Adjustable |
| Weight | Approximately 90kg |
| Power Supply | AC100V (1.5kw) |
| Air Consumption | Compressed air 0.2～0.4MPa |
| Nitrogen Consumption | 0～0.5MPa |
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