Features of the MALCOM SFA-1 Reflow Soldering Image Analyzer:
- Analyzes the soldering process using reflow oven images.
- Evaluates the solder joints’ adhesion to the PCB based on the shape of the solder.
Specifications of the MALCOM SFA-1 Reflow Soldering Image Analyzer:
| Component | Specification |
|---|---|
| System | Circulation sensor: Pentium4 3.2GHz RAM: 1GB Hard drive: 720GB Graphics card: Onboard DVD-RW |
| Image Processing | Full-frame processing (30 frames/s) |
| Maximum Analysis Time | Up to 1 minute 30 seconds |
| Operating System (OS) | Windows XP |
| Size | W200 × H425 × D465 (mm) |
Camera:
| Feature | Specification |
|---|---|
| Format | NTSC |
| Sensor Type | 1/4″ Interline CCD |
| Effective Pixels | H768 × V494 |
| Scanning Method | Aspect ratio: 1/2 |
| Scan Frequency | Horizontal: 15.734kHz, Vertical: 59.94Hz |
Lens:
| Feature | Specification |
|---|---|
| Optical Magnification | 0.75～4.5x |
| Working Distance (W.D.) | 90mm |
| Camera Depth of Field | 1.6mm |
| Field of View | 4.8 × 3.6 ~ 0.8 × 0.6 mm |
Illumination:
| Feature | Specification |
|---|---|
| Light Source | 150W halogen lamp |
| Lamp Lifespan | 500 hours |
| Average Illumination | 45000Lx |
| Power Supply | AC 100V ±10%, 50Hz ~ 60Hz |
| Power Consumption | 330VA |
| Size | W120 × H119 × D252 (mm) |
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