MALCOM SP-2 – Solderability Tester

Usage

SP-2 is wettability testing machine for solder paste, parts electrode and PC board, adopted SP-Tension-Method （Temperature Profile Method)

Feature

Can test and evaluate solder paste, PC board and parts-lead.
All wetting process can be observed from glass windows.
“Wetting Balance Measuring Method”,”Micro-Wetting Balance Measuring Method”, and “Quick Heating Method” are possible optionally.
Can simulate reflow oven profile with hot air and N2 purge.
Electro-balance sensor adopted allows detection of very small force.The wettability of microchips can now be examined by this unit.
Analyze wetting time and force with exclusive software.
Solder wire testing is also available.

tem		Specifications
Load Sensor	Principle	Electro – balance sensor
	Measurement range	10.00gf～－5.00gf
	Measurement accuracy *	± (10mgf + 1 digit)
	Resolution	Less than 900 mgf: 0.001 gf More than 900 mgf: 0.005 gf
Temp. Sensor	Measurement range	0～300℃
	Measurement accuracy	±3℃
Heater unit	Temp. of heater unit	Room temperature ～ 300℃
	O2 Concentration	Simple closed heater unit with nipple for N2 purge test
Temp. profile setting		1. Preheat temp. 2. Preheat time 3. The rate of temp. rise 3℃ /sec. (standard) 4. Maximum temp. 5. Maximum temp. time
Melting point		Preset solder paste melting point
Table movement		Automatic: operated by PC Manual: operated by Up/Down switch (selectable 3 steps speed)
Digital output		RS-232C cable (Malcom format)
Air supply		Original air pressure: 0.2～0.5 Mpa (Approx. 2～5 kgf / cm2) Adjustment air: 0.2 Mpa (Approx. 2kgf / cm2 )
Power supply		AC100V 50 / 60Hz 700W
Weight		Approx. 20kg