MALCOM SRS-1C Reflow Simulator

Features of the MALCOM SRS-1C Reflow Simulator:

• Simulates Melting Processes: The device simulates the melting process and monitors the temperature profile of both lead-free solder and solder paste.
• Targeted Heating: Allows targeted heating of specific areas on the PCB, ensuring even temperature distribution, especially in areas with lower thermal balance.
• Adjustable Heating Parameters: Users can set heating temperatures and durations, with the capability to extend the time at peak temperature.
• Three-Sided PCB Viewing: Equipped with a three-sided observation window for monitoring the PCB.

Specifications of the MALCOM SRS-1C Reflow Simulator:

• PCB Size: Less than 70W × 70L mm; top side height less than 10 mm.
• Size:
  • Heating unit: 320 (W) × 285 (D) × 310 (H) mm
  • Control unit: 290 (W) × 235 (D) × 270 (H) mm
• Heating Method:
  • Top: Hot air
  • Bottom: Infrared
• Cooling: Nitrogen or air with a water-cooled valve.
• Power Supply: 3-phase 200V 50/60Hz, 3 kVA.
• Air Supply: 0.3–0.5 MPa, 100 liters/min (max).
• Oxygen Concentration in Oven with Nitrogen: Minimum 100 ppm (sealed oven structure).
• Top Heating: Hot air, 2.8 kW (350W × 8).
• Bottom Heating: Infrared, 360W.
• Heating Accuracy: Less than 5°C (center of a 50W × 50L mm PCB).
• Temperature Range: Ambient to 330°C.
• Temperature Measurement Points: 3
• Nitrogen Supply: Adjustable valve, 25 liters/min.
• Control Software: SRS-1CS; OS: Windows XP.
• Weight:
  • Heating unit: 12 kg
  • Control unit: 8 kg

>>> Learn more: List of Welding Test Instruments