Features of the MALCOM SRS-2 Reflow Simulator:
- Measurement of Component Deformation: Capable of measuring deformation in electronic components and PCBs caused by heating.
- Repeated Deformation Measurement: Performs continuous deformation measurements using an X-Y axis strain gauge.
- Multiple Measurement Points: Allows for the establishment of up to 19 measurement points based on temperature and time.
- Advanced Analysis Software: Equipped with software to analyze thermal charts and deformation data.
- Observation of Solder Paste Melting: Uses a combined camera system to observe the solder paste melting process.
Specifications of the MALCOM SRS-2 Reflow Simulator:
- PCB Size: W70×L70 mm, with height under 10mm.
- Dimensions: W652×D411×H425 mm.
- Heating Method: Upper: Hot air, infrared; Lower: Infrared.
- Cooling Method: External air (nitrogen or air).
- Power Supply: 3-phase 200V, 50/60Hz, 1.5kVA.
- Air Supply: 0.3～0.5MPa, 100l/min (MAX).
- Oxygen Concentration in Oven: Minimum 100ppm when using nitrogen.
- Upper Heating: Hot air: 675W; Infrared: 300W.
- Lower Heating: Infrared: 240W.
- Temperature Accuracy: Within 5°C at the PCB center.
- Measurement Range: X-axis: Maximum 70mm; Y-axis: Maximum 70mm; Z-axis: 0～3mm.
- X-Y Axis Operation Speed: Maximum 45mm/s.
- Weight: 50kg.
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