SWB-2 Feature:
- The entire procedure, from Flux application (w/ Flux Temperature Control Function) to Measurement End is automated. Reducing unstable measurement results, and user error
- Complies with the Wetting test method according to JIS Z3198 (Lead Free Solder Test Method) standards
- Easily change Solder and Flux when necessary
- Efficiently analyze data with the exclusive PC software. (option)
- An optional cover allows for wetting evaluation in a N2 environment. (option)
MALCOM SWB-2 – Wetting Balance Tester Specifications
Load sensor | Principle | Electro-Balance Sensor (EBS) |
Measuring Range | 30mN – -30mN | |
Accuracy | +/-0.05mN | |
Resolution | 0.01mN | |
Temp. Sensor | Measuring Range | 0 – 450C |
Accuracy | +/-3C | |
Insertion Time | 1 – 200s | |
Insertion Depth | 0.01 – 20.00mm (0.01mm step) | |
Insertion Speed | 0.1 – 30mm/s | |
Solder Temp. Setting | Room Temp. – 400C (Micro-wetting : Room Temp. – 320C) | |
Japanese Standard | Automatic Measurement (Flux Application, Removal and Measurement) , JIS Z3198-4 and C60068-2-54 JEITA ET7401 (Solder Bath) |
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International Standard | ISO 9455-16 IEC 60068-2-54 and 60068-2-69 (Solder bath) ANSI J-STD-003 MIL STD-883 (Method 2022.2) and IPC TM-650 (2.4.14.2) |
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N2 Measurement | Oxygen Concentration : 500ppm max. (optional) | |
Power Supply | AC100V | |
Outer Dimension | 300W x 330D x 370H mm | |
Weight | Approx. 16kg |
*The measurement accuracy of the load sensor excludes the error margin such as the vibrations or others.
*When high-speed infiltrating, the vibration of the table might influence the measurement result.
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