Features of the MALCOM TK-1S Solder Paste Tackiness Tester:
- Electronic Component & PCB Deformation Measurement: Capable of measuring deformation in electronic components and PCBs caused by heating.
- X-Y Axis Strain Gauge: Enables repeated deformation measurements on the X-Y axis.
- Multiple Measurement Points: Allows for up to 19 measurement points based on temperature and time settings.
- Analytical Software: Comes with software to analyze thermal graphs and deformation data.
- Camera System Integration: Includes a camera system for observing the melting process of solder paste.
Specifications of the MALCOM TK-1S Solder Paste Tackiness Tester:
| Item | Specifications |
|---|---|
| Weight Sensor | Measurement Range: 0～400gf ±2gf, Resolution: 0.25gf |
| Dipping Methods | (1) Constant pressure dipping (JIS) |
| (2) Constant amount dipping | |
| (3) Constant point dipping (IPC) | |
| Measurement Results | (1) Tackiness: T gf |
| (2) Actual pulse force: P gf | |
| (3) Actual dipping amount: D μm | |
| Setup Conditions | (1) Pulse force: -20～-400gf |
| (2) Pulse time: 0.1～99.9s | |
| (3) Pull-off speed: 1.0～10.0mm/s (constant pressure/constant amount) or 2.0～600.0mm/min (constant point) | |
| (4) Dipping amount: 20～200μm | |
| (5) Temperature: Room temperature +10℃～250℃ | |
| Weight | Approx. 10kg |
>>> Learn more: List of Solder Paste Viscometer
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