Features of MID-S300 3D SPI:
- High-density marble platform provides assurance for high-precision imaging.
- Multi-angle light sources combined with high-resolution cameras and telecentriclenses greatly enhance detection results.
- Silk screen interference removal algorithm, to remove the positioning errors caused by silk screen interference.
- Can be integrated with the MES system according to the needs of the factory.
- Powerful SPC software provides rich and accurate data statistics.
- High precision motion system ensures the walking and stopping accuracy under high-speed motion.
Specifications of MID-S300 3D SPI:
| Model | MID-S300 3D SPI | ||
| Type | Single Lane | Dual Lane | |
| Vision system | Camera | 12MP Industrial Camera | |
| Resolution | 5μm/10μm/15μm | ||
| Inspect Speed | 8.6c㎡/s 34.3c㎡/s 77.1c㎡/s | ||
| illumination | RGBW LED | ||
| Hardware | Power Supply | 200V-230V AC 50/60Hz | |
| Power | 2.2KW | ||
| Pressure | 0.4-0.6MPa | ||
| Weight | 1100KG | 1200KG | |
| Equipment size (mm) | W1156*D1475*H1640 | W1156*D1700*H1640 | |
| Check specifications | PCB size (mm) | 50*50~510*460 | 50*50~510*330 (Dual mode) 50*50~510*600 (Single mode) |
| PCB thickness (mm) | 0.6~6 | ||
| Measure height | Parts up to 30mm in height can be measured | ||
| Optional function | Artificial intelligence | AI data training center | |
| Auxiliary function | Remote repair, Barcode reading, OCR recognition | ||
| Inspection items | Defect type | Excess Solder, Insufficient solder, Skip, Bridge, Exposed copper, Shift… | |
Defects detected by AI
>>> See more: MID-P300 3D AOI High-speed side camera
Reviews
There are no reviews yet.