SINTAIKE STK-6120 Semi Automatic Wafer Taper

SINTAIKE STK-6120 Semi Automatic Wafer Taper of Characteristic:

• Desktop
• Suitable for 8”&12” wafers
• Easy to operate

STK-6120 Semi Automatic Wafer Taper of Feature:

• Wafer revenue：≥99.9%
• Tear film quality : No bubbles (excluding dust particle bubbles)
• Production capacity per hour: ≥ 75 wafers
• MTBF: > 168 hour
• MTTR: < 1 hour
• Downtime: < 3%
• Product replacement time < 5 minutes

Technical specifications SINTAIKE STK-6120:

• Wafer size: 8”& 12”
• Regular product thickness: 300 ~ 750 micron
• Wafer type：Silicon, gallium arsenide or other materials
• Film type：Blue film or UV film (adhesion ≤8N/20mm)
• Width : 240 ~ 340mm
• Length: 100 mét
• Thickness: 0,05 ~ 0,2 mm
• Film principle: Anti-static roller film, adjustable roller pressure
• Wafer stage: Universal (one-piece) Teflon anti-static coating contact table
• The table can be heated: room temperature ~100℃
• Manual lift of tabletop
• Loading and unloading method : Manual wafer placement and removal
• Anti-static control: Anti-static Teflon coated wafer table/anti-static film roller/static ion fan
• Cutting system : Straight cutter and ring cutter, 8″ and 12″ without cutting V notch function, the cutting knife can be heated: room temperature ~ 120℃
• Wafer positioning: Pneumatic pin positioning
• Control unit: Based on PLC control with 7″ touch screen
• Security: Configure emergency stop button
• Voltage: Phase AC 220V, 10A
• Compressed air: 5kg clean and dry compressed air, flow rate 100 liters/minute
• Machine shell: White plastic spray metal shell
• Volume : 670mm (width)*1180mm (depth)*1000mm (including lamp height)
• Net weight: 140kg

>>> Read more: Wafer Applicators