SINTAIKE STK-6150 Advanced Semi-Automatic Wafer Thinning and Laminating Machine
Product Features:
- Flexible roller lamination + spring blade system, suitable for 8”-12” wafers
- Automatic film feeding
- Automatic anti-static roller lamination
- Automatic cutting, waste film collection, and liner paper collection
- Equipped with safety light curtain
- Equipped with emergency stop button
- Manual operation only required for loading and unloading
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