SINTAIKE STK-8050 Semi-Automatic Temporary Wafer Bonder

STK-8050 Semi-Automatic Temporary Wafer Bonder

Product Features

• Wafer size: 4″, 6″, & 8″
• Loading/unloading method: Manual wafer loading and unloading
• Bonding method: Vacuum bonding
• Chuck: One chuck configured for each wafer size
• Control unit: PLC-based control with a 7″ touchscreen
• UV curing unit: LED UV lamp

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