Advantages of TAMURA EC-19S-A Flux:
- Excellent soldering performance, suitable for all types of lead-free alloys such as Sn/Ag/Cu, Sn/Ag/Cu/Bi, and Sn/Cu.
- Effectively removes non-wetting or poor solder joint issues when the circuit contains mixed components or detached parts.
- As a non-rosin flux, it ensures that solder joints remain free from gloss after soldering, which is beneficial for visual inspection.
- Minimal flux residue with near-transparent color, preventing hand-stickiness after soldering.
- Excellent performance in eliminating the solder gloss.
- Residual flux does not cause corrosion, providing excellent electrical insulation after soldering.
- Whether foaming or spraying, the coating is evenly distributed.
Specifications of TAMURA EC-19S-A Flux:
Item | EC-19S-A | Measurement Method |
---|---|---|
Appearance | Liquid | Visual |
Density | 0.822 (20℃) | JISZ3197(1999) 8.2.2 |
Solid Content | 13.5 (%) | JISZ3197(1999) 8.1.3 |
Color | Transparent light yellow | Visual |
Viscosity | 4.4 (mPa·S) | JISZ3197(1999) 8.2.1 |
Halogen Content | 0.08 (%) | JISZ3197(1999) 8.1.4.2.1 |
Flux Diffusion Rate | 77 (%) | JISZ3197(1999) 8.3.1.1 |
Water Solution Resistance | 5×10⁴ (Ω•cm) | |
Residue Corrosion | Pass | JISZ3197(1999) 8.4.1 |
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