TAMURA EC-25 Flux

• Superior soldering performance, compatible with lead-free alloys like Sn/Ag/Cu, Sn/Ag/Cu/Bi, Ag/Cu, etc.
• Reduces issues with poor wetting and faulty solder joints on circuit boards.
• Excellent through-hole penetration and deoxidation properties.
• Non-oxidizing residue ensures outstanding insulation for components post-soldering.
• Even distribution of flux on surfaces, whether applied by spray or foam methods.

Specifications of TAMURA EC-25 Flux:

• Name: ULF-210R
• Specific Gravity (20°C): 0.822 (JISZ3197-1999)
• Solid Content: 15% (JISZ3197-1999)
• Color: Transparent yellow (Visual inspection)
• Viscosity (mPa•S): 4.5 (30°C, JISZ3197-1999)
• Halogen Content: 0.08% (JISZ3197-1999)