Introduction to the Characteristics of Tamura LFSOLDER GP-213-167 Lead-Free Solder Paste
Uses lead-free alloy (composed of Sn, Ag, Cu).
The printing quality and structure in the solder paste remain stable during continuous printing.
Excellent wetting for electronic components.
Superior soldering performance is maintained under high temperature conditions.
Outstanding reliability is guaranteed even without cleaning the flux residue.
Specifications of TAMURA GP-213-167 Lead-Free Solder Paste
Table 1
| Item | Characteristics | Test Method |
|---|---|---|
| Alloy Composition | Sn 98.3 / Ag 1.0 / Cu 0.7 | JIS Z 3282 (1999) |
| Melting Point | 217~224°C | DSC Test |
| Solder Paste Particle Size | 20~36μm | Laser Refractive Method |
| Solder Powder Shape | Spherical | JIS Z 3284 (1994) |
| Flux Content | 11.9% | JIS Z 3284 (1994) |
| Chlorine Content | 0.0% | JIS Z 3197 (1999) |
| Viscosity | 200 Pa.s | JIS Z 3284 (1994) |
| Viscosity Measurement | Malcom PCU 25°C |
Table 2
| Item | Characteristics | Test Method |
|---|---|---|
| Solution Resistivity | > 1×10^4 Ω·cm | JIS Z 3197 (1999) |
| Insulation Resistance | > 1×10^9 Ω·cm | JIS Z 3284 (1994) |
| Flowability Test | < 0.20mm | Heat solder paste on a ceramic board at 150°C for 60s. Measure width before and after heating for flow amplitude. STD-092b |
| Solder Ball Test | Almost no solder balls | Heat solder paste on a ceramic board, then observe under 50x magnification after heating to melting point. STD-009e |
>>> Read more: Low Silver Solder Paste
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