TAMURA GP-216-HF17 is a lead-free solder paste made with a special solder alloy and flux. Free from lead, it contributes to global environmental protection. Even without cleaning the flux residue on PCBs, it maintains high reliability.
Advantages of TAMURA GP-216-HF17 Lead-Free Solder Paste:
- Uses lead-free solder alloy (comprising Sn, Ag, Cu).
- Stable printing quality and structure during continuous printing processes.
- Excellent wetting performance for electronic components.
- Superior soldering performance remains intact even under high temperatures, including air reflow.
- High reliability is maintained even without cleaning flux residues.
Specifications of TAMURA GP-216-HF17 Lead-Free Solder Paste:
| Category | Specification | Test Method |
|---|---|---|
| Alloy Composition | Sn96.8/Ag0.3/Cu0.7/Bi2.0/In0.2 | JIS Z 3282 (1999) |
| Melting Point | 210~224°C | DSC Test Method |
| Solder Powder Size | 20~36μm | Laser Diffraction Method |
| Powder Shape | Spherical | JIS Z 3284 (1994) |
| Flux Content | 12.5% | JIS Z 3284 (1994) |
| Chlorine Content | 0.0% | JIS Z 3197 (1999) |
| Viscosity | 200 Pa.s | JIS Z 3284 (1994) |
>>> Read more: Low Silver Solder Paste
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