TAMURA RMA-010-FP Leaded Solder Paste – Product Features:
- Suitable for printing fine-pitch traces with spacing of 0.3~1 mm.
- Forms stable fillet at QFP leads.
- Excellent soldering performance, especially for crystalline components, enhancing the wetting properties of the paste.
- Almost no solder ball formation around the chip.
- Superior solder separation, ideal for high-precision component printing.
Technical Specifications:
| Product Name | RMA-010-FP | Test Method |
|---|---|---|
| Alloy Composition | Sn63/Pb37 | JISZ3282 |
| Melting Point | 183°C | DSC Testing |
| Solder Particle Size | 22-45 µm | Laser Light Diffraction |
| Flux Content | 9.5% | IPC-TM-650 |
| Halogen Content | 0.13% | JISZ3284, MIL-F-14256F |
| Viscosity | 210 Pa.s | JISZ3284 |
>>> See more: There Is Lead Solder Paste
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