Advantages of TAMURA RMA-20-31 Leaded Solder Paste
- Maintains stability during continuous soldering.
- Virtually eliminates tin ball formation around chips.
- Exceptional wetting performance for all component types.
- Stable viscosity over time.
Specifications of TAMURA RMA-20-31 Leaded Solder Paste
Item | Characteristics | Testing Method |
---|---|---|
Alloy Composition | Sn62.8/Pb36.8/Ag0.4 | JIS Z 3282 (1986) |
Melting Point | 179~183°C | DSC Testing |
Particle Size | 20~38 µm | Laser Diffraction Method |
Flux Content | 9.8±0.3% | JIS Z 3284 (1994) |
Halogen Content | 0.0 | JIS Z 3197 (1999) |
Viscosity | 160-190 Pa.s | JIS Z 3284 (1994), Malcom PCU, 25°C |
>>> See more: There Is Lead Solder Paste
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