Advantages of TAMURA TLF-204-111A Lead-Free Solder Paste
- Uses lead-free alloy including tin, silver, and copper.
- Leaves almost no solder balls around the chip after soldering.
- Maintains stability during continuous soldering.
- Demonstrates superior soldering performance even with very small gaps in micro-component soldering.
- Excellent wettability for all types of components.
- Retains superior soldering performance under high-temperature conditions.
- Minimizes solder voids.
- No solder splash occurs when soldering gold-plated leads.
Specifications of TAMURA TLF-204-111A Lead-Free Solder Paste
Item | Characteristic | Testing Method |
---|---|---|
Alloy Composition | Sn 96.5 / Ag 3.0 / Cu 0.5 | JIS Z 3282 (1999) |
Melting Point | 216~220°C | Tested using DSC |
Solder Powder Size | 25~40 μm | Laser Diffraction Method |
Flux Content | 11.6% | JIS Z 3284 (1994) |
Chlorine Content | <0.1% | JIS Z 3197 (1999) |
Viscosity | 215 Pa.s | JIS Z 3284 (1994), Malcom PCU at 25°C |
Thixotropic Index | 0.53 | JIS Z 3284 (1994) |
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