LFSOLDER TLF-204-151 is a Pb-free, no-clean solder paste using Pb-free, spherical solder powder and special flux. The type of solder paste is lead-free, which minimizes the use of hazardous materials, contributing to environmental protection and creating a safer workplace. Halide-free flux residue does not need to be removed.
Features of TAMURA TLF-204-151:
- Pb-free (Sn/Ag/Cu series) solder alloy；
- Stable printability with little change in viscosity during continuous printing；
- Reduces mid-chip solder balls；
- Does not slump in pre-heat;
- Excellent solderability at high temperature；
Characteristics of TAMURA TLF-204-151:
| Items | Characteristics | Test methods |
| Alloy composition | Sn 96.5 / Ag 3.0 / Cu 0.5 | JIS Z 3282 (1999) |
| Melting point | 216～220℃ | According to DSC measurement |
| Particle size of solder | 25～41µm | Measure by laser diffraction method |
| Shape of solder powder | Spherical | Annex 1 to JIS Z 3284(1994) |
| Flux content | 12.1% | JIS Z 3284 (1994) |
| Chlorine content* | 0.0 % | JIS Z 3197 (1999) |
| Viscosity | 210 Pa･s | Annex 6 to JIS Z 3284 (1994)
Malcom PCU viscometer at 25℃ |
| Water solution resistance test | More than 1×104 Ω·cm | JIS Z 3197 (1999) |
| Insulation resistance test | More than 1×109 Ω | Board type 2, Annex 3 to JIS Z 3284(1994)
Testing board is made by reflow soldering |
| Slump test | Less than 0.15mm | Print the paste on ceramics board and heat for 60 seconds at 150℃. Measure slump width from before and after heating. STD-092b※ |
| Solder ball test | Solder balls seldom occur | Print the paste on ceramics board. After melting and heating, observe with a microscope of 50 times. STD-009e※ |
| Solder spread test | More than 75% | JIS Z 3197 (1986) 6.10 |
| Copper plate corrosion test | No corrosion | Annex 12 to JIS Z 3284 (1994) |
| Tackiness test of residue | Pass | Annex 12 to JIS Z 3284(1994) |
>>>> Read more: List of Lead – Free Solder Paste
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