Advantages of TAMURA TLF-204-153 Lead-Free Solder Paste
- Utilizes lead-free tin alloy (Sn, Ag, Cu).
- Halogen-free flux.
- Very small viscosity variation during continuous printing, ensuring stable print quality.
- Excellent solderability in normal air conditions, with superior soldering performance during reflow.
- Maintains outstanding solderability even under high-temperature conditions.
- Stable performance without the need for cleaning residual flux.
Characteristics of TAMURA TLF-204-153 Lead-Free Solder Paste
| Item | Characteristic | Testing Method |
|---|---|---|
| Alloy Composition | Sn 96.5 / Ag 3.0 / Cu 0.5 | JIS Z 3282 (1999) |
| Melting Point | 216~220°C | Tested using DSC |
| Solder Powder Size | 20~38 μm | Laser Diffraction Method |
| Solder Powder Shape | Spherical | JIS Z 3284 (1994) |
| Flux Content | 12.0% | JIS Z 3284 (1994) |
| Chlorine Content | 0.0% (in flux) | JIS Z 3197 (1999) |
| Viscosity | 210 Pa.s | JIS Z 3284 (1994), Malcom PCU at 25°C |
Additional Testing Results
| Test Item | Result | Testing Method |
|---|---|---|
| Resistivity of Flux | > 1×10^4 Ω·cm | JIS Z 3197 (1999) |
| Insulation Resistance | > 1×10^9 Ω·cm | JIS Z 3284 (1994) |
| Slump Test | < 0.20 mm | STD-092b |
| Solder Ball Formation | Nearly no solder balls | STD-092b |
| Solder Diffusion | 70% or more | JIS Z 3197 (1986) 6.10 |
| Copper Board Corrosion | No corrosion | JIS Z 3197 (1986) 6.6.1 |
| Residual Solder Adhesion | Pass | JIS Z 3284 (1994) |
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