LFSOLDER TLF-204-167 is a Pb-free and cleaning-free solder paste used Pb-free spherical solder
powder and special flux. Since this solder paste contains no Pb, the usage of hazardous materials is
reduced, furthermore, the environment and the safe workplace are protected. As its flux residue contains no halides, it can be remained on the PCB without cleaning.
| ● TLF-204-167Features： |
- Pb-free (Sn/Ag/Cu series) alloy solder is used.
- Stable printability and shape of the printed solder paste are obtained with little change in viscosity during continuous printing.
- Chip-side ball seldom occur.
- Excellent solderability at high temperature.
- Superior reliability is ensured without cleaning the flux residue.
| TLF-204-167 Specification： |
| Items | Characteristics | Test methods |
| Alloy composition | Sn 96.5 / Ag 3.0/ Cu 0.5 | JIS Z 3282 (1999) |
| Melting point | 216～220℃ | DSC measurement |
| Particle size of solder powder | 20-38μm | Laser diffraction method |
| Shape of solder powder | Spherical | Annex 1 to JIS Z 3284 (1994) |
| Flux content | 11.70% | JIS Z 3284 (1994) |
| Chlorine content* | 0.00% | JIS Z 3197 (1999) |
| Viscosity | 200 Pa·s | Annex 6 to JIS Z 3284 (1994) |
| Viscometer type PCU-205 | ||
| manufactured by Malcom, at 25℃ |
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