LFSOLDER TLF-204-171A is the Pb-free and cleaning-free solder paste used Pb-free spherical solder powder and special flux. Since this solde paste contains no Pb, the usage of hazardous materials is reduced, furthermore, the environment and the safe workplace are protected.
| ● TLF-204-171AFeatures： |
1) Pb-free (Sn/Ag/Cu series) solder alloy is used.
2) Stable printability and shape of the printed solder paste are obtained with little change in viscosity during continuous printing.
3) Excellent wettability for electronic component and land pattren.
4) Excellent solderability is brought with the reflow profile with high peak temperature.
5) Superior reliability is ensured without cleaning the flux residue.
| ● TLF-204-171A Specification： |
| Items | Characteristics | Test methods |
| Alloy composition | Sn 96.5 / Ag 3.0 / Cu 0.5 | JIS Z 3282（1999） |
| Melting point | 216～220℃ | DSC measurement |
| Particle size of solder powder | 20-38µm | Laser diffraction method |
| Shape of solder powder | Spherical | Annex 1 to JIS Z 3284 (1994) |
| Flux content | 12.1 % | JIS Z 3284 (1994) |
| Chlorine content ※ | 0.0％ | JIS Z 3197 (1999) |
| Viscosity | 175Pa・s | Annex 6 to JIS Z 3284 (1994) Viscometer, type PCU, manufactured by Malcom., at 25℃ |
* Inspected the flux itself only
>>> More:Welding Consumables
3 reviews for TAMURA TLF-204-171A – Pb-Free Solder Paste
There are no reviews yet.