LFSOLDER TLF-204-27F4 is a solder paste, using special flux and spherical solder powder of Pb-free (SnAgCu).
As the paste contains no Pb, it will largely contribute to the protection of global environment. Furthermore,
excellent reliability can be obtained with the flux without cleaning. Also, residual flux after reflow can be
removed by hydrocarbon cleaning solvent and semi-water based cleaning solvent etc.
| ● TLF-204-27F4 Features： |
a) Pb-free (Sn/Ag/Cu series) solder alloy is used.
b) Residual flux after reflow can be removed by hydrocarbon cleaning solvent and semi-water based cleaning
solvent etc.
c) Excellent printability with fine pattern of 0.4mm-Pitch can be obtained.
d) Being very good in solderability, an adequate wettability is shown for the land and parts.
e) Excellent solderability can be attained for a high peak temperature.
| ● TLF-204-27F4 Specification： |
| Items | Characteristics | Test methods |
| Alloy composition | Sn96.5/Ag3.0/Cu0.5 | JIS Z 3282(1994) |
| Melting point | 216～220℃ | According to DSC measurement |
| Particle size of solder powder | 10～25 μm | According to laser diffraction method |
| Shape of solder Powder | Spherical | Annex 1 to JIS Z 3284(1994) |
| Flux content | 11.9 % | JIS Z 3284 (1994) |
| Chlorine content | 0.0 % | JIS Z 3197(1999) |
| Viscosity | 180 Pa・s | Annex 6 to JIS Z 3284(1994)
Viscometer,type PCU, Manufactured by Malcom at 25℃ |
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