Advantages of TAMURA TLF-204-49 lead-free solder paste
- Use lead-free alloys including: tin/silver/copper.
- Around the chip after soldering, there is almost no tin shadow left.
- Maintain stability during continuous welding.
- In micro-component welding conditions, very small distances still demonstrate outstanding solderability.
- Extremely good wetting properties for all types of components.
- Excellent weldability is maintained under high temperature conditions
Specifications of TAMURA TLF-204-49 lead-free solder paste
| Category | Characteristic | Experimental methods |
| Alloy composition | Sn96.5/Ag3.0/Cu0.5 | JISZ3282(1999) |
| Melting point | 216~220 độ C | DSC |
| Particle size of tin powder | 20~38um | Use laser refraction method |
| Soldering flux content | 11.7% | JIS Z 3284 (1994) |
| Chlorine | <0.0% | JIS Z 3197 (1999) |
| Stickiness | 170 Pa.s | JIS Z 3284 (1994)
Malcom PCU |
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