Advantages of TAMURA TLF-204-93 Lead-Free Solder Paste:
- Uses lead-free alloy (Sn/Ag/Cu).
- High stability, with viscosity remaining unchanged during continuous printing.
- Maintains excellent soldering performance even with a small 0.5mm gap between components.
- Excellent wetting properties for all types of components.
- Performs well under high reflow temperatures with excellent heat resistance.
Specifications of TAMURA TLF-204-93 Lead-Free Solder Paste:
Item | Characteristic | Testing Method |
---|---|---|
Alloy Composition | Sn 96.5 / Ag 3.0 / Cu 0.5 | JIS Z 3282 |
Melting Point | 216-220°C | DSC |
Particle Size | 25-41 μm | Laser Diffraction |
Flux Content | 11.6% | IPC-TM-650 |
Halogen Content | 0.1% | JIS Z 3197 |
Viscosity | 205 Pa·s | JIS Z 3284 |
>>> More: Lead – Free Solder Paste
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