TLF-204-93IVT(SH) Features:
- Pb-free (Sn/Ag/Cu series) solder alloy
- Stable printability with little change in viscosity during continuous printing
- Reduces void formatin
- Reduces mid-chip solder balls
- Does not slump in pre-heat
- Excellent solderability at high temperature
- Excellent solderability on fine pitch patterns of 0.5mm pitch CSP
TLF-204-93IVT(SH) Parameter:
| Items | TLF-204-93IVT(SH) | Test method |
| Alloy composition | Sn96.5/Ag3.0/Cu0.5 | JIS Z 3282(1999) |
| Melting point (℃) | 216~220 | DSC |
| Particle size (μm) | 25~38 | Laser diffractometry |
| Shape of solder powder | Spherical | JIS Z 3284(1994) |
| Flux content (%) | 10.9 | JIS Z 3284(1994) |
| Chlorine content (%) | 0.0 | JIS Z 3284(1994) |
| Viscosity (Pa・s) | 200 | JIS Z 3284(1994) |
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