Features of Tamura TLF-204-GTS-VR1(YK):
- Lead-free solder paste for screen printing；
- High insulation reliability without cleaning the flux residues；
- Excellent printability can be attained at fine pattern of 0.4mm pitch CSP;
- The reliable flux reduces its residue cracks after reflow and suppresses electro-chemical migration；
Characteristics of TAMURA TLF-204-GTS-VR1(YK):
| Items | Characteristics | Test methods |
| Alloy composition | Sn 96.5 / Ag 3.0 / Cu 0.5 | JIS Z 3282 (2017) |
| Melting point | 216～220℃ | According to DSC measurement |
| Particle size | Type 4 | JIS Z 3284-2(2014) |
| Particle shape | Spherical | JIS Z 3284-2(2014) |
| Halide content in flux | 0.1% or less than | JIS Z 3197 (2012) |
| Viscosity | 200 Pa･s | JIS Z 3284-3 (2014)
Malcom PCU viscometer at 25℃ |
| Water solution resistance test | 1×104 Ω*cm or higher | JIS Z 3197 (2012) |
| Insulation resistance test (85 deg. C / 85RH%) | 1×108 Ω*cm or higher | JIS Z 3197 (2012)
The specimen is prepared by reflow oven |
| Heat slump test | 0.3 mm | JIS Z3284-3(2014)
Heating temperature is 180 deg. C |
| Solder ball test | Category 2 | JIS Z 3284-4 (2014) |
| Solder spread test | More than 80% | JIS Z Z3197(1986) |
| Copper plate corrosion test | No corrosion | JIS Z3197(1986) |
| Tackiness test of flux residue | Pass | Pass JIS Z3284(1994), Annex 12 |
| Flux activity classification | ROL1 | J-STD-004A |
※ Test method of our company
(The written characteristics is not a guarantee value)
>>>> Read more: List of Lead – Free Solder Paste
Reviews
There are no reviews yet.