LFSOLDER TLF-204-HF33 is the Pb-free solder paste which it used spherical Pb-free solder powder and special flux. As the paste contains no Pb, it will largely contribute to the protection of global environment. Furthermore, excellent reliability can be obtained with the flux withoutwashing.
Outstanding Features of Tamura TLF-204-HF33:
Pb-free (Sn/Ag/Cu series) solder alloy is used.
Stable printability and shape of the printed solder paste are obtained with little change in viscosity during continuous printing.
Excellent solderability can be attained for a high temperature.
Superior reliability is provided by no washing.
Characteristics of Tamura TLF-204-HF33:
| Items | Characteristics | Test methods |
| Alloy composition | Sn 96.5 / Ag 3.0 / Cu 0.5 | JIS Z 3282 (1999) |
| Melting point | 216～220℃ | According to DSC measurement |
| Particle size of solder powder |
20～38μm | According to laser diffraction method |
| Shape of solder powder | Spherical | Annex 1 to JIS Z 3284 (1994) |
| Flux content | 12.3% | JIS Z 3284 (1994) |
| Chlorine content* | Less than 0.05% | JIS Z 3197 (1999) |
| Viscosity | 200 Pa･s | Annex 6 to JIS Z 3284 (1994)
Viscometer, type PCU, manufactured by Malcom, at 25℃ |
| Water solution resistance test | More than 1×104 Ω･cm |
JIS Z 3197 (1999) |
| Insulation resistance test | More than 1×109 Ω |
Board type 2,Annex 3 to JIS Z 3284 (1994)
Reflow: By reflow soldering system. |
| Slump test | Less than 0.2mm | Print the paste on ceramics board and heat for 60 seconds at 150℃. Measure slumping with from before and after heating. STD-092b※ |
| Solder ball test | Solder balls seldom occur | Print the paste on ceramics board. After melting and heating, observe with a microscope of 50 times. STD-009e※ |
| Solder spread test | More than 80% | JIS Z 3197 (1986) 6.10 |
| Copper plate corrosion test | No corrosion | Annex 4 to JIS Z 3284 (1994) |
※ Test method of our company (The written characteristics is not a guarantee value.)
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