Introduction to TAMURA TLF-204-NH(20-36) Lead-Free Solder Paste
- TAMURA TLF-204-NH(20-36) uses lead-free tin-based alloy (comprising tin, silver, and copper).
- It utilizes halogen-free flux.
- The adhesion remains remarkably stable during continuous printing, ensuring consistent printing quality.
- Even under normal atmospheric conditions, the soldering performance is excellent during reflow.
- The solder paste maintains superior soldering capabilities even at high temperatures.
- High stability is retained even if flux residue is not cleaned after printing.
Technical Specifications of TAMURA TLF-204-NH(20-36) Lead-Free Solder Paste:
Table 1
| Item | Property | Test Method |
|---|---|---|
| Alloy composition | Tin 96.5 / Silver 3.0 / Copper 0.5 | JIS Z 3282 (1999) |
| Melting point | 216~220°C | Using DSC tester |
| Solder particle size | 20~36 μm | Laser diffraction method |
| Solder material shape | Particle form | JIS Z 3284 (1994) |
| Flux content | 11.8% | JIS Z 3284 (1994) |
| Chlorine content | 0.0% (in flux) | JIS Z 3197 (1999) |
| Viscosity | 180 Pa.s | JIS Z 3284 (1994), PCU tester at 25°C |
Table 2
| Item | Property | Test Method |
|---|---|---|
| Solution resistivity | Greater than 1 x 10^4 Ω·cm | JIS Z 3197 (1999) |
| Insulation resistance | Greater than 1 x 10^9 Ω·cm | JIS Z 3284 (1994) |
| Flowability test | Less than 0.20 mm | Heated at 150°C for 60s, measured before and after heating. STD-092b |
| Solder bead test | Nearly no solder balls | Heated solder paste on a ceramic plate, observed under a 50x microscope. STD-009e |
| Solder diffusion test | 70% or more | JIS Z 3197 (1986) 6.10 |
| Copper corrosion test | No corrosion | JIS Z 3197 (1986) 6.6.1 |
| Residual solder adhesion test | Pass | JIS Z 3284 (1994) Appendix 12 |
>>> Read more: Lead-Free Halogen-Free Solder Paste
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