LFSOLDER TLF-204F-171S is the Pb-free solder paste which it used spherical Pb-free solder powder and special flux. As the paste contains no Pb, it will largely contribute to the protection of global environment. Furthermore, excellent reliability can be obtained with the flux withoutwashing.
Outstanding Features:
- Pb-free (Sn/Ag/Cu series) solder alloy is used.
- Stable printability and shape of the printed solder paste are obtained with little change in viscosity during continuous printing.
- Excellent wettability is attained at fine pattern of CSP.
- Excellent solderability can be attained for a high temperature.
- Superior reliability is provided by no washing.
Characteristics of Tamura TLF-204F-171S:
| Items | Characteristics | Test methods |
| Alloy composition | Sn 96.5 / Ag 3.0 / Cu 0.5 | JIS Z 3282 (1999) |
| Melting point | 216～220℃ | According to DSC measurement |
| Particle size of solder powder | 10～30μm | According to laser diffraction method |
| Shape of solder powder | Spherical | Annex 1 to JIS Z 3284 (1994) |
| Flux content | 12,8% | JIS Z 3284 (1994) |
| Chlorine content* | Less than 0.05% | JIS Z 3197 (1999) |
| Viscosity | 210 Pa･s | Annex 6 to JIS Z 3284 (1994)
Viscometer, type PCU, manufactured by Malcom, at 25℃ |
* Inspected the flux itself only
>>> Read more: Lis of Lead-Free Solder Paste
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