LFSOLDER TLF-204F-TNA23K is the Pb-free solder paste using Pb-free spherical solder powder and halogen-free flux. As the paste contains no Pb, it will largely contribute to the protection of global environment. Furthermore, excellent reliability can be obtained with the flux without washing.
Outstanding features:
- Pb-free (Sn96.5/Ag3/Cu0.5) solder alloy is used.
- Stable printability with little change in viscosity during continuous printing.
- Halogen-free solder paste with type5 solder particle size .
- Good solderability on small pads under long preheat time
- Superior reliability is provided by no washing.
Characteristics of Tamura TLF-204F-TNA23K:
| Items | Characteristics | Test methods |
| Alloy composition | Sn 96.5 / Ag 3.0 / Cu 0.5 | JIS Z 3282(2006) |
| Melting point | 216～220℃ | According to DSC measurement |
| Particle size of solder powder | 15-25μm | According to laser diffraction method |
| Flux content | 12,3% | JIS Z 3197(2012) |
| Chlorine content* | 0.0% | JIS Z 3197(2012) |
| Viscosity | 190Pa・s | JIS Z 3284-3(2014)
Viscometer, type PCU, manufactured by Malcom., at 25℃* Inspected the flux itself only |
※Result of examination in flux.
>>> Read more: Lis of Lead-Free Solder Paste
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