LFSOLDER TLF-204F-NHS is the Pb-free and Halogen-free solder paste which it used spherical Pb-free solder powder and the halogen-free flux. Also, after reflow, the flux residue of this paste becomes with
halogen free, because it does not include halogen. Even if this paste corresponds to the fine pattern, because the small solder powder is used excellent printability is obtained. As the paste contains no Pb, it will largely contribute tothe protection of global environment. Furthermore, excellent reliability can it will largely contribute tothe protection of global environment. Furthermore, excellent reliability can be obtained with the flux withoutwashing.
Outstanding Features of TAMURA TLF-204F-NHS Solder paste:
- Pb-free (Sn/Ag/Cu series) solder alloy is used.
- Halogen-free flux is used.
- Excellent printability can be attained at fine pattern of 0.4mm pitch CSP, because the small solder powder is used.
- Stable printability is obtained with little change in viscosity during continuous printing.
- Having a good solderability even in air reflow.
- Excellent solderability can be attained for a high peak temperature.
- Superior reliability is provided by no washing.
Characteristics of TAMURA TLF-204F-NHS Solder paste:
| Items | Characteristics | Test methods |
| Alloy composition | Sn 96.5 / Ag 3.0 / Cu 0.5 | JIS Z 3282 (1999) |
| Melting point | 216～220℃ | According to DSC measurement |
| Particle size of solder powder | 10～30µm | According to laser diffraction method |
| Shape of solder powder | Spherical | Annex 1 to JIS Z 3284 (1994) |
| Flux content | 12.1% | JIS Z 3284 (1994) |
| Chlorine content* | 0.0 % | JIS Z 3197 (1999) |
| Viscosity | 210 Pa･s | Annex 6 to JIS Z 3284 (1994)
Viscometer, type PCU, manufactured by Malcom, at 25℃ |
| Water solution resistance test | More than 1×104 Ω･cm | JIS Z 3197 (1999) |
| Insulation resistance test | More than 1×109 Ω | Board type 2,Annex 3 to JIS Z 3284 (1994)
Reflow: By reflow soldering system. |
| Slump test | Less than 0.25mm | Print the paste on ceramics board and heat for 60 seconds at 150℃. Measure slumping width from before and after heating. STD-092b※ |
| Solder ball test | Solder balls seldom occur. | Print the paste on ceramics board. After melting and heating, observe with a microscope of 50 times. STD-009e※ |
| Solder spread test | More than 70% | JIS Z 3197 (1986) 6.10 |
| Copper plate corrosion test | No corrosion | JIS Z 3197 (1986) 6.6.1 |
| Tackiness test of residue | Pass | Pass Annex 12 to JIS Z 3284 (1994) |
※ Test method of our company (The written characteristics is not a guarantee value.)
>>> Read more: List of Lead – Free Solder Paste (SAC 305)
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