Advantages of TAMURA TLF-204G-HFW Lead-Free Solder Paste
- Ultra-fine powder particles, with sizes below 15μm.
- Excellent printing performance, compatible with 0201 chips.
- High wettability.
- Halogen-free flux.
- Residual flux can be cleaned with a washing agent after soldering.
Specifications of TAMURA TLF-204G-HFW Lead-Free Solder Paste
Item | Characteristic | Testing Method |
---|---|---|
Alloy Composition | Sn 96.5 / Ag 3.0 / Cu 0.5 | JIS Z 3282 (2006) |
Melting Point | 216~220°C | Tested using DSC |
Solder Powder Size | 5~15 μm | Laser Diffraction Method |
Flux Content | 11.3% | JIS Z 3197 (2012) |
Chlorine Content | 0.0% | JIS Z 3197 (2012) |
Viscosity | 190 Pa.s | JIS Z 3284-3 (2014) |
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