TAMURA TLF-286-GTS-VR5 Lead-Free Solder Paste Features:
- Exhibits excellent heat resistance and reliability, even during high-temperature reflow, with no compromise in soldering quality under thermal shock cycles.
- Uses a Pb-free alloy (Sn/Ag/Cu/Bi/Sb system).
- Provides superior thermal insulation in high-temperature and high-humidity conditions.
- Prevents cracking and residue flux after reflow, especially with N2 reflow conditions.
Technical Specifications of TAMURA TLF-286-GTS-VR5 Lead-Free Solder Paste:
| Item | Specification | Test Method |
|---|---|---|
| Alloy Composition | Sn / Ag 3.0 / Cu 0.7 / Bi 3.2 / Sb 3.0 | JIS Z 3910(2017) |
| Melting Point | 209~224°C | JIS Z 3198-1(2014) |
| Solder Particle Size | 20~38μm | Laser Diffraction Method |
| Solder Particle Shape | Spherical | JIS Z 3284-2(2014) |
| Flux Content | 11.5% | JIS Z 3197(2012) |
| Halogen Content | 0% | JIS Z 3197(2012) |
| Viscosity | 210 Pa.s | JIS Z 3284-3(2014) |
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