LFSOLDER TLF204F-GT30-NH-R is a non-halogen type lead-free solder paste.
Features of TLF204F-GT30-NH-R:
- Pb-free (Sn/Ag/Cu series) solder alloy is used and the solder alloy is made from recycled tin
- Non-halogen type flux is used
- Excellent printability can be attained at fine pattern of 0.4mm pitch CSP.
- Stable printability is obtained with little change in viscosity during continuous printing.
- Superior reliability is provided by no cleaning of flux.
Characteristics of Tamura TLF204F-GT30-NH-R:
| Item | Characteristics | Test method |
| Alloy compositon | Sn96.5 / Ag3.0 / Cu0.5 | JIS Z 3282(2017) |
| Melting point | 216 – 220℃ | According to DSC measurement |
| Particle size of solder powder | 10 – 30μm | According to laser diffraction method |
| Shape of solder powder | Spherical | JIS Z 3284-2(2014) |
| Flux content | 12.1 % | JIS Z 3197(2021) |
| Halide content | 0.0 % | JIS Z 3197(2021) |
| Viscosity | 210 Pa･s | JIS Z 3284-1 (2014)
Viscometer, type PCU, manufactured by Malcom, at 25℃ |
| Insulation resistance test | More than 1×109 Ω | JIS Z 3197 (2021), 85℃/85RH%
The specimen is prepared by reflow oven. |
| Solder spread test | More than 70% | JIS Z 3197(1986) |
| Copper plate corrosion test | No corrosion | JIS Z 3197(2021) |
>>> Read more: Lis of Lead-Free Solder Paste
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