TAMURA ULF-210RH Flux

• Leaves minimal residue after soldering, preventing issues like Check-Pin.
• High compatibility of flux and resin ensures reliable coating.
• Despite having low solid content, it ensures good wetting on pads, especially for QFPs, and prevents solder bridging on small components.

TAMURA ULF-210RH Flux Specifications:

• Appearance: Liquid (Visual inspection)
• Density (20℃): 0.802 (JISZ3197, 1986)
• Solid content: 5% (100℃, 1h)
• Color: Transparent yellow (Visual inspection)
• Viscosity (mPa·S) (30℃): 3 (JISZ3197, 1986)
• Halogen content: 0 (JISZ3197, 1986)
• Flux spread rate: 88% (JISZ3197, 1986)
• Water resistance (Ω·cm):
• Corrosion of residue: Passes (JISZ3197, 1986)