Advantages of Lead-Free TAMURA ULF-45-13 Flux:
- Eliminates cracking of soldering flux residue on the PCB.
- Maintains excellent insulation properties even in high temperature and humidity conditions.
- Provides excellent wetting and soldering performance on various components.
Comparison with Post-Flux Rosin:
- Cracking of residual flux occurs after heat treatment.
- Thermal cycle test: -30°C to 80°C (30 minutes each cycle), 3000 cycles.
Specifications of Lead-Free TAMURA ULF-45-13 Flux:
| Item | ULF-45-13 | Measurement Method |
|---|---|---|
| Appearance | Pale yellow liquid | Visual inspection |
| Color Number | 4 | JISZ3197(1999) |
| Specific Gravity (20°C) | 0.855 | JISZ3197(1999) |
| Solid Content | 13% | JISZ3197(1999) |
| Acid Value | 18 | JISZ3197(1999) |
| Viscosity (mPa•S) (30°C) | 6.6 | JISZ3197(1999) |
| Chlorine Content | 0.05% | JISZ3197(1999) |
| Solder Flux Diffusion Rate | 88% | JISZ3197(1999) |
| Flash Point | 17°C | JIS K 2539 |
| Residue Corrosion Resistance | Pass | JISZ3197(1999) |
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