About TLF TLF-204-GTS-VR1 Lead-free solder paste:
TLF is solder paste used to bond components on circuit boards of electronic devices with high durability. Furthermore, the cream will contribute significantly to environmental protection when using lead-free spherical solder powder of Sn/Ag/Cu alloy. No cleaning is required after soldering because the residual flux retains maximum stability after TCT (heating cycle test). In addition, the insulation layer is not affected by TCT
Features of TLF TLF-204-GTS-VR1 Lead-free solder paste:
- Prevents excess flux residue
- Use lead-free solder alloy (Sn/Ag/Cu)
- Maximum thermal insulation properties can be achieved under conditions of high temperature and humidity.
- Superior reflow efficiency is maintained
- Reduce the amount of solder balls
- Reduces void formation
Specifications:
| Alloy composition | Sn96.5/Ag.3.0/Cu0.5 |
| Melting Point (Start of Melting / End of Melting) | 216/220℃ |
| Particle size of tin particles | 20-36mm |
| Solder powder content | 88.6% |
| Viscosity | 200 Pa･s |
| Chlorine content | 0.0% |
| Copper plate corrosion experiment | Non-corrosive |
| Packaging unit | 500g |
| Expiry | 90 days from date of manufacture if stored, tightly closed, at temperature below 10℃. |
>>> More: Lead – Free Solder Paste
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